Article provided by: Laserod
How is Laser Dicing Silicon Being Processed
Laserod has a division that focuses on the building and integration of a full line of fiber laser micromachining equipment and a diode that can be used for laser dicing silicon wafer, resistor trimming, scribing substrates of silicon and alumina, and cutting thin plastics and metals. We also offer services for large and small equipment configurations, lasers, and machines capable of large production.
The Process of Laser Dicing Silicon
Laser dicing is part of an electronic process to resize or cut substrates or silicon. The process of dicing using an ultra-fast laser has produced no damage of the weak surrounding when a material is resized, cut or removed
Manufacturers face challenges on how to maximize a wafer and be used as a semiconductor for different devices. The devices continue to get complicated and tinier while the circuit increases its density. The added complexity is because of the chip materials and design trends that use die to attach wafers and films that are very thin.
During the fabrication process, wafer dicing is essential to the quality of the final product. There are two methods for wafer dicing, laser ablation dicing, and blade dicing. Either of these processes causes damages, product debris, and a possibility of losing the quality of semiconductor material.
Cutting from the Inside
Another laser technique is stealth dicing, it can help overcome the dicing problem as it cuts the wafer from the inside. This methods induce the laser to a subsurface perforation and followed by using a tape expansion in separating individual chips.
The subsurface treatment will then use a pulse laser beam, a wavelength transmitted through the wafer. If a pure silicon wafer is used, it favors a near-infrared laser over short wavelength laser, because silicon absorbs shorter wavelength. If the laser beam is pulsed it can focus to a point under the wafer surface through an optical system. Once the laser beam hits the wafer it absorbs the energy creating a pinpoint hole. The laser beam then travels through the wafer with processing speed and perforates the wafer’s inner layer while the surfaces remain untarnished.
Laser Dicing Silicon Wafers
Silicon wafer is thicker and is usually cut using diamond blades or saws. The cutting speed, blade’s thickness, size, grit and rotating speed affects the quality of the finished product. This technique despite being refined through the years still causes flaws that cannot be disregarded. The chipping of the wafer usually occurs because of an irregular force of the sawing process.
The laser ablation offers alternative blade technique for dicing thicker silicon wafers, however, it is too powerful in cutting thin and delicate wafers. This technique can also cause a few microcracks and molten debris when the laser vaporizes the wafer. The debris is not easy to clean and results in a die chip with lower strength.
The best option is stealth dicing as it does not cause chipping and reduces wafer loss because it uses an extremely narrow path in dicing. This technique causes no heat damage either as the laser cuts through the surface, allowing resistance to develop and prevent breakage.
If you need help in precision cutting, contact us at Laserod so we can give you free advice and quotations for our products and services.